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Toshiba Samsung Storage Technology Corporation (abbreviated TSST) is a former international joint venture company of Toshiba and Samsung Electronics (South Korea). Toshiba used to own 51% of its stock, while Samsung used to own the remaining 49%. The company specialized in optical disc drive manufacturing. The company was established in 2004.
Arm Ltd. (sells designs only) Amazon (AWS Graviton is ARM-based); Apple Inc. (ARM-based CPUs) Broadcom Inc. (ARM-based, e.g. for Raspberry Pi) Fujitsu (its ARM-based CPU used in top supercomputer, still also sells its SPARC-based servers)
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...
Samsung also said it will step up offerings of high-end solid-state drive (SSD) products to meet AI server demand, and expected high-end memory chip supply to become tighter toward year-end due to ...
The first devices resembling solid-state drives (SSDs) used semiconductor technology, with an early example being the 1978 StorageTek STC 4305. This device was a plug-compatible replacement for the IBM 2305 hard drive, initially using charge-coupled devices for storage and later switching to dynamic random-access memory (DRAM).
Samsung 55-Inch Class QLED 4K The Frame Smart TV 35% OFF ... 128GB of memory storage and 5G cellular technology. ... It has a 144-hertz display with adaptive sync technology to reduce input lag ...
Samsung 55-inch NEO ... Dyson V7 Cordless Vacuum for $220 . Stearns and Foster Cooling Memory Foam Pillows for $ ... Innovative color technology means you'll see a wider spectrum of colors than on ...
To the right is a smaller heat sink cooling another integrated circuit of the motherboard. Typical heatsink-fan combination found on a consumer laptop. The heatpipes which contain a working fluid make direct contact with the CPU and GPU, conducting heat away from the component and transferring it to the fin-stack mounted on the exhaust port of ...