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  2. Solderability - Wikipedia

    en.wikipedia.org/wiki/Solderability

    Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.

  3. Brazing - Wikipedia

    en.wikipedia.org/wiki/Brazing

    Braze welding is the use of a bronze or brass filler rod coated with flux to join steel workpieces. The equipment needed for braze welding is basically identical to the equipment used in brazing. Since braze welding usually requires more heat than brazing, acetylene or methylacetylene-propadiene gas fuel is commonly used. The name comes from ...

  4. List of copper alloys - Wikipedia

    en.wikipedia.org/wiki/List_of_copper_alloys

    A bronze is an alloy of copper and other metals, most often tin, but also aluminium and silicon. Aluminium bronzes are alloys of copper and aluminium. The content of aluminium ranges mostly between 5% and 11%.

  5. List of brazing alloys - Wikipedia

    en.wikipedia.org/wiki/List_of_brazing_alloys

    Used for joining carbide tool tips to steel holders. Light yellow color. May contain 0.2% silicon for better flow. For induction, torch and furnace brazing. 55: 35: 4: 6: Cu 87 Mn 10 Co 2: Cu–Mn 960/1030 [31] – Hi-Temp 870. High-temperature strength. Free-flowing. For carbides, stainless steels, tool steels, and nickel alloys.

  6. Diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Diffusion_bonding

    Diffusion bonding or diffusion welding is a solid-state welding technique used in metalworking, capable of joining similar and dissimilar metals. It operates on the principle of solid-state diffusion, wherein the atoms of two solid, metallic surfaces intersperse themselves over time.

  7. Eutectic bonding - Wikipedia

    en.wikipedia.org/wiki/Eutectic_bonding

    Eutectic bonding to transfer epitaxial materials such as GaAs-AlGaAs onto silicon (Si) substrates with high yields for the general purpose of optoelectronics integration with Si electronics as well as to overcome fundamental issues such as lattice mismatch in hetero-epitaxy, was developed and reported by Venkatasubramanian et al. in 1992, and ...

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