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Engineering samples are the beta versions of integrated circuits that are meant to be used for compatibility qualification or as demonstrators. [1] They are usually loaned to OEM manufacturers prior to the chip's commercial release to allow product development or display. [ 2 ]
For a complex engineering system containing thousands of assemblies, sub-assemblies, components, organized into several levels of indenture and with a number of possible repair decisions, LORA seeks to determine an optimal provision of repair and maintenance facilities to minimize overall system life-cycle costs.
Stone damage, or stone-chip, is the damage that gravel and small stones can make to a vehicle. Stone damage is most common on roads on which the allowed speed exceeds 70 km/h (43 mph; 19 m/s), since stones stuck in the tires come loose at that speed and fly away with such a speed that they can damage other vehicles.
The process capability index, or process capability ratio, is a statistical measure of process capability: the ability of an engineering process to produce an output within specification limits. [1] The concept of process capability only holds meaning for processes that are in a state of statistical control. This means it cannot account for ...
A windscreen wiper (Commonwealth English) or windshield wiper (American English) is a device used to remove rain, snow, ice, washer fluid, water, or other debris from a vehicle's front window. Almost all motor vehicles , including cars , trucks , buses , train locomotives , and watercraft with a cabin —and some aircraft —are equipped with ...
Since 2021, some smartphones, laptops, televisions, washing machines, lawnmowers and other electronic devices sold in France have been required to report a repairability index (French: Indice de réparabilité) which rates how repairable a product is on a scale from 0 to 10, primarily to prevent corporate greenwashing and encourage environmental transparency.
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Testing is carried out to prevent faulty chips from being assembled into relatively expensive packages. The yield is often but not necessarily related to device (die or chip) size. As an example, in December 2019, TSMC announced an average yield of ~80%, with a peak yield per wafer of >90% for their 5nm test chips with a die size of 17.92 mm 2.