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Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.
Micromachining, semiconductor processing, microelectronic fabrication, semiconductor fabrication, MEMS fabrication and integrated circuit technology are terms used instead of microfabrication, but microfabrication is the broad general term.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
Notes: Pure-play foundries – They specialize in foundry services. They may or may not offer design services to third parties, as well as mask making, semiconductor packaging and testing services, which can also be outsourced to other companies. An example is TSMC, which offers design, testing and packaging services, TCE photomasks, which ...
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
Typically thick film circuit substrates are Al 2 O 3 /alumina, beryllium oxide (BeO), aluminum nitride (AlN), stainless steel, sometimes even some polymers and in rare cases even silicon (Si) coated with silicon dioxide (SiO 2)., [5] [6] Commonly used substrates for thick-film processes are 94 or 96% alumina. Alumina is very hard and lasering ...
Ceramic leadless package of Intel 80286 (bottom) [6] A leadless chip carrier ( LCC ) has no " leads ", but instead has rounded pins through the edges of the ceramic or molded plastic package. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic, while high-volume products for consumer and ...