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Solder makes a strong electrical and mechanical connection. Point-to-point wiring is not suitable for automated assembly (though see wire wrap , a similar method that is) and is carried out manually, making it both more expensive and more susceptible to wiring errors than PCBs, as connections are determined by the person doing assembly rather ...
Dip soldering is used for both through-hole printed circuit assemblies, and surface mount. It is one of the cheapest methods to solder and is extensively used in the small scale industries of developing countries . Dip soldering is a manual equivalent of automated wave soldering. The apparatus required is just a small tank containing molten solder.
Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount.
Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...
During automated SMT pick-and-place, this happens mostly if the mechanical pressure of the SMD placer nozzle is too low. If the MELF components are placed into the solder paste with enough pressure, then this problem can be minimized. Care must be taken with glass diodes which are less mechanically robust than resistors and other MELF components.
A tube of multicore electronics solder used for manual soldering. For attachment of electronic components to a PCB, proper selection and use of flux helps prevent oxidation during soldering; it is essential for good wetting and heat transfer. The soldering iron tip must be clean and pre-tinned with solder to ensure rapid heat transfer.
Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. The main manufacturing technique is screen printing ( stenciling ), which in addition to use in manufacturing electronic devices can also be used for ...