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  2. Hot-melt adhesive - Wikipedia

    en.wikipedia.org/wiki/Hot-melt_adhesive

    Hot-melt adhesive (HMA), also known as hot glue, is a form of thermoplastic adhesive that is commonly sold as solid cylindrical sticks of various diameters designed to be applied using a hot glue gun.

  3. Araldite - Wikipedia

    en.wikipedia.org/wiki/Araldite

    Araldite adhesive sets by the interaction of an epoxy resin with a hardener. Mixing an epoxy resin and hardener together starts a chemical reaction that produces heat – an exothermic reaction. [2] It is claimed that after curing the bond is impervious to boiling water and to all common organic solvents.

  4. J-B Weld - Wikipedia

    en.wikipedia.org/wiki/J-B_Weld

    J-B Weld epoxy is a two-part adhesive that can bond various surfaces and withstand high temperatures up to 500 °F (260 °C) constantly and 600 °F (316 °C) for short periods. It is water-resistant, petroleum/chemical-resistant, acid-resistant, and resists shock, vibration, and temperature fluctuations.

  5. Pressure-sensitive adhesive - Wikipedia

    en.wikipedia.org/wiki/Pressure-sensitive_adhesive

    Styrene block copolymers (SBC), also called styrene copolymer adhesives and rubber-based adhesives, have good low-temperature flexibility, high elongation, and high heat resistance. They are frequently used in hot melt adhesive applications, where the composition retains tack even when solidified; however non-pressure-sensitive formulations are ...

  6. Thread-locking fluid - Wikipedia

    en.wikipedia.org/wiki/Thread-locking_fluid

    Thread-locking fluid or threadlocker is a single-component adhesive, applied to the threads of fasteners such as screws and bolts to prevent loosening, leakage, and corrosion. Most thread-locking formulas are methacrylate -based and rely on the electrochemical activity of a metal substrate to cause polymerization of the fluid.

  7. Thermal adhesive - Wikipedia

    en.wikipedia.org/wiki/Thermal_adhesive

    Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.

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