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  2. Point-to-point construction - Wikipedia

    en.wikipedia.org/wiki/Point-to-point_construction

    An intermediate form of construction uses terminal strips (sometimes called "tag boards"), eyelet boards or turret boards. Note that if components are arranged on boards with tags, eyelets or turrets at both ends and wires going to the next components, then the construction is correctly called tag, eyelet or turret construction respectively, as ...

  3. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.

  4. Conductive anodic filament - Wikipedia

    en.wikipedia.org/wiki/Conductive_anodic_filament

    CAF commonly occurs between adjacent vias (i.e. plated through holes) inside a PCB, as the copper migrates along the glass/resin interface from anode to cathode.CAF failures can manifest as current leakage, intermittent electrical shorts, and even dielectric breakdown between conductors in printed circuit boards. [3]

  5. Desoldering - Wikipedia

    en.wikipedia.org/wiki/Desoldering

    Desoldering may be required to replace a defective component, to alter an existing circuit, or to salvage components for re-use. Use of too high a temperature or heating for too long may damage components or destroy the bond between a printed circuit trace and the board substrate. Techniques are different for through-hole and surface-mounted ...

  6. Through-hole technology - Wikipedia

    en.wikipedia.org/wiki/Through-hole_technology

    Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.

  7. Perfboard - Wikipedia

    en.wikipedia.org/wiki/Perfboard

    The 0.1 inches (2.54 mm) grid system accommodates integrated circuits in DIP packages and many other types of through-hole components. Perfboard is not designed for prototyping surface mount devices. Before building a circuit on perfboard, the locations of the components and connections are typically planned in detail on paper or with software ...

  8. Via fence - Wikipedia

    en.wikipedia.org/wiki/Via_fence

    Via hole equivalent circuit. The design of the fence needs to consider the size and spacing of the vias. Ideally, vias should act as short circuits, but they are not ideal and a via equivalent circuit can be modelled as a shunt inductance. Sometimes, a more complex model is required such as the equivalent circuit shown in figure 4.

  9. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.