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Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Hot-melt adhesives have a long shelf life and usually can be disposed of without special precautions. Some of the disadvantages involve thermal load of the substrate, limiting use to substrates not sensitive to higher temperatures, and loss of bond strength at higher temperatures, up to complete melting of the adhesive.
Adhesive, also known as glue, cement, mucilage, or paste, [1] is any non-metallic substance applied to one or both surfaces of two separate items that binds them together and resists their separation. [2] The use of adhesives offers certain advantages over other binding techniques such as sewing, mechanical fastenings, and welding. These ...
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Single-phase immersion uses a circulation method for the dielectric liquid across hot electronic components and to a heat exchanging approach. A single-phase fluid does not boil or undergo a phase change at any time during the cooling process. Two-phase immersion leverages the heat-absorbing phase change from liquid to gas [3]. It uses ...