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In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw ) [ 2 ] or laser cutting .
Diamond wire saw in stone industry. A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire [1] to dice, cut, or groove semiconductor wafers, and glass, ceramic, crystal, and many other types of material.
CVD diamond growth typically occurs under low pressure (1–27 kPa; 0.145–3.926 psi; 7.5–203 Torr) and involves feeding varying amounts of gases into a chamber, energizing them and providing conditions for diamond growth on the substrate. The gases always include a carbon source, and typically include hydrogen as well, though the amounts ...
Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film upon which the wafer is mounted ...
These wafers are then polished to the desired degree of flatness and thickness. In the past, conventional circular saws were used during the 1950s and 1960s, followed by inner diameter saws in the 1970s and 1980s. These saws had diamond particles embedded into their blades to cut silicon. Multi-wire saws were introduced during the early 2000s.
GlobalWafers said in 2022 it would build a $5 billion plant in Texas to make 300-mm silicon wafers used in semiconductors, switching from a defunct plan to invest in Germany.
A semiconductor crystal boule is normally cut into circular wafers using an inside hole diamond saw or diamond wire saw, and each wafer is lapped and polished to provide substrates suitable for the fabrication of semiconductor devices on its surface. [4]
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