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2. Solder mask - Wikipedia

   en.wikipedia.org/wiki/Solder_mask

   Printed circuit board with green solder mask coating.. Solder mask, solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads.

3. Pin brazing - Wikipedia

   en.wikipedia.org/wiki/Pin_brazing

   Pin brazing is a metallurgically safe [citation needed] method of making electrical connections [1] to steel and ductile iron pipelines [citation needed] as well as other metallic structures, [2] which are to be cathodically protected or electrically earthed.

4. List of brazing alloys - Wikipedia

   en.wikipedia.org/wiki/List_of_brazing_alloys

   General purpose filler metal for aluminium soldering/brazing with a torch. Grayish-white color. 98: 2: ... Can be used in protective atmosphere (e.g. hydrogen ...

5. Organic solderability preservative - Wikipedia

   en.wikipedia.org/wiki/Organic_Solderability...

   It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering. Compared to the traditional HASL process, the OSP process is widely used in the electronics manufacturing industry because it does not require high-temperature treatment and significantly reduces the risk of metal corrosion ...

6. Electrical tape - Wikipedia

   en.wikipedia.org/wiki/Electrical_tape

   Electrical tape (or insulating tape) is a type of pressure-sensitive tape used to insulate electrical wires and other materials that conduct electricity. It can be made of many plastics but PVC (polyvinyl chloride, "vinyl") is the most popular, as it stretches well and gives effective and long-lasting insulation.

7. Conformal coating - Wikipedia

   en.wikipedia.org/wiki/Conformal_coating

   Conformal coating is a protective, breathable coating of thin polymeric film applied to printed circuit boards (PCBs). Conformal coatings are typically applied with 25–250 μm [ 1 ] thickness on electronic circuitry to protect against moisture and other substances.