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  2. Solder mask - Wikipedia

    en.wikipedia.org/wiki/Solder_mask

    Printed circuit board with green solder mask coating.. Solder mask, solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads.

  3. Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board...

    High volume production is usually done with a pick-and-place machine and bulk wave soldering for through-hole parts or reflow ovens for SMT components or through-hole parts, but skilled technicians are able to hand-solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.) [29] under a microscope, using tweezers and a ...

  4. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.

  5. Perfboard - Wikipedia

    en.wikipedia.org/wiki/Perfboard

    Top of a copper clad Perfboard with solder pads for each hole. Perfboard is a material for prototyping electronic circuits.It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of 0.1 inches (2.54 mm) spacing.

  6. Kapton - Wikipedia

    en.wikipedia.org/wiki/Kapton

    Kapton tape (yellow) used to insulate the leads of a battery cell in a bluetooth headset. Due to its large range of temperature stability and its electrical isolation ability, Kapton tape is usually used in electronic manufacturing as an insulation and protection layer on electrostatic-sensitive and fragile components.

  7. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Alternatively, SMT and through-hole components can be soldered on the same side of a board without adhesive if the SMT parts are first reflow-soldered, then a selective solder mask is used to prevent the solder holding those parts in place from reflowing and the parts floating away during wave soldering. Surface mounting lends itself well to a ...

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    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

  9. Organic solderability preservative - Wikipedia

    en.wikipedia.org/wiki/Organic_Solderability...

    It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering. Compared to the traditional HASL process, the OSP process is widely used in the electronics manufacturing industry because it does not require high-temperature treatment and significantly reduces the risk of metal corrosion ...

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