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The following is a list of CMOS 4000-series digital logic integrated circuits.In 1968, the original 4000-series was introduced by RCA.Although more recent parts are considerably faster, the 4000 devices operate over a wide power supply range (3V to 18V recommended range for "B" series) and are well suited to unregulated battery powered applications and interfacing with sensitive analogue ...
A very early CD4029A counter IC, in 16-pin ceramic dual in-line package (DIP-16), manufactured by RCA Colorized IC die and schematics of CD4011BE NAND gateThe 4000 series was introduced as the CD4000 COS/MOS series in 1968 by RCA [1] as a lower power and more versatile alternative to the 7400 series of transistor-transistor logic (TTL) chips.
Intel and 3M developed the ceramic leadless quad in-line package (QUIP), introduced in 1979, to boost microprocessor density and economy. [3] The QUIP is not designed for surface-mount use, and requires a socket. The chip itself lacks the normal pins, and instead ends in small metal pads on a flat carrier, these make contact with spring-loaded ...
A spare part, spare, service part, repair part, or replacement part, is an interchangeable part that is kept in an inventory and used for the repair or refurbishment of defective equipment/units.
The Quad 4 is the first domestic regular production DOHC four-cylinder engine wholly designed and built by GM, the only similar prior example being the Chevrolet Cosworth Vega, whose DOHC head was designed by Cosworth in England. In addition to the 2.3-liter DOHC Quad 4s, there was also a short-lived 2.3-liter SOHC variant called the "Quad OHC ...
A lattice can then be built up enabling the transport of the beam over long distances—for example round an entire ring. A common lattice is a FODO lattice consisting of a basis of a focusing quadrupole, 'nothing' (often a bending magnet), a defocusing quadrupole and another length of 'nothing'.
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits.Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged.
The cylindrical ion trap consists of a central cylindrical electrode (ring electrode) and two end-cap electrodes. By applying a combination of static and oscillating voltages to these electrodes, a three-dimensional quadrupole field is generated. The ions are trapped in the center of this field due to the restoring forces created by the ...
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