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OCuLink (standing for "optical-copper link", since Cu is the chemical symbol for copper) is an extension for the "cable version of PCI Express". Version 1.0 of OCuLink, released in Oct 2015, supports up to 4 PCIe 3.0 lanes (3.9 GB/s) over copper cabling; a fiber optic version may appear in the future.
On August 2, 2022, the CXL Specification 3.0 was released, based on PCIe 6.0 physical interface and PAM-4 coding with double the bandwidth; new features include fabrics capabilities with multi-level switching and multiple device types per port, and enhanced coherency with peer-to-peer DMA and memory sharing.
Download as PDF; Printable version; In other projects ... CXL Specification 3.0 & 3.1 ... (using PCI Express 4.0 ×4 link)
It has produced the PCI, PCI-X and PCI Express specifications. As of 2024, the board of directors of the PCI-SIG has representatives from: AMD, ARM, Dell EMC, IBM, Intel, Synopsys, Keysight, NVIDIA, and Qualcomm. The chairman and president of the PCI-SIG is Al Yanes, a "Distinguished Engineer" from IBM.
Mobile PCI Express Module (MXM) is an interconnect standard for GPUs (MXM Graphics Modules) in laptops using PCI Express created by MXM-SIG. The goal was to create a non-proprietary, industry standard socket, so one could easily upgrade the graphics processor in a laptop, without having to buy a whole new system or relying on proprietary vendor upgrades.
Download as PDF; Printable version; In other projects ... BTX Interface Specification 1.0b ... PCI Express (PCIe) 4.0 2010/11/18 PMBus:
The most commonly used pin outs are Type 6 and Type 10. The latest pin-out added in revision 3.0 of the COM Express specification (available from www.picmg.org) is Type 7. The Type 7 provides up to four 10 GbE interfaces and up to 32 PCIe lanes, making COM Express 3.0 appropriate for data center, server, and high-bandwidth video applications.
Download as PDF; Printable version; ... The USB 3.0 Promoter Group announced on 17 November 2008 that the specification of version 3.0 ... many "PCI Express to ...