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  2. FR-2 - Wikipedia

    en.wikipedia.org/wiki/FR-2

    FR-2 (Flame Resistant 2) is a NEMA designation for synthetic resin bonded paper, a composite material made of paper impregnated with a plasticized phenol formaldehyde resin, used in the manufacture of printed circuit boards. Its main properties are similar to NEMA grade XXXP (MIL-P-3115) material, and can be substituted for the latter in many ...

  3. CutePDF - Wikipedia

    en.wikipedia.org/wiki/CutePDF

    CutePDF is a proprietary Portable Document Format converter and editor for Microsoft Windows developed by Acro Software. [1] [2] CutePDF Writer can create PDF files, [3] and CutePDF Form Filler can edit simple PDF forms so that they can be sent without using more expensive PDF authoring software.

  4. Rogers Corporation - Wikipedia

    en.wikipedia.org/wiki/Rogers_Corporation

    Rogers offers liquid cooling materials designed to dissipate large amounts of heat, and provide thermal management of high-power laser diodes and other heat-generating optical devices. The cooling structures are copper foil channels bonded into a tight block, with aluminum-nitride (AlN) isolation layers added for extra performance.

  5. Phenolic paper - Wikipedia

    en.wikipedia.org/wiki/Phenolic_paper

    Phenolic paper is a material often used to make printed circuit board (PCB) substrates (the flat board to which electronic components and traces are attached). It is a very tough board made of wood fibre and phenolic polymers. It is most commonly brown in colour, and is a fibre reinforced plastic.

  6. Power electronic substrate - Wikipedia

    en.wikipedia.org/wiki/Power_electronic_substrate

    The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components.. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation (up to several thousand vo

  7. Chip on board - Wikipedia

    en.wikipedia.org/wiki/Chip_on_board

    The PCB of a quartz watch. The clock IC is under the drop of black epoxy. Chip on board (COB) is a method of circuit board manufacturing in which integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. [1]

  8. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    The resist material protects the copper from dissolution into the etching solution. The etched board is then cleaned. A PCB design can be mass-reproduced in a way similar to the way photographs can be mass-duplicated from film negatives using a photographic printer. FR-4 glass epoxy is the most common insulating substrate.

  9. Printed circuit board milling - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board_milling

    A milled printed circuit board. Printed circuit board milling (also: isolation milling) is the milling process used for removing areas of copper from a sheet of printed circuit board (PCB) material to recreate the pads, signal traces and structures according to patterns from a digital circuit board plan known as a layout file. [1]