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A 2008 review paper written by Philips researcher Clemens J. M. Lasance notes that: "Although there is an analogy between heat flow by conduction (Fourier's law) and the flow of an electric current (Ohm’s law), the corresponding physical properties of thermal conductivity and electrical conductivity conspire to make the behavior of heat flow ...
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
Interfacial thermal resistance is a measure of an interface's resistance to thermal flow. This thermal resistance differs from contact resistance, as it exists even at atomically perfect interfaces. Understanding the thermal resistance at the interface between two materials is of primary significance in the study of its thermal properties.
In most countries the properties of specific materials (such as insulation) are indicated by the thermal conductivity, sometimes called a k-value or lambda-value (lowercase λ). The thermal conductivity (k-value) is the ability of a material to conduct heat; hence, the lower the k-value, the better the material is for insulation.
Some constants, such as the ideal gas constant, R, do not describe the state of a system, and so are not properties. On the other hand, some constants, such as K f (the freezing point depression constant, or cryoscopic constant ), depend on the identity of a substance, and so may be considered to describe the state of a system, and therefore ...
The thermal coefficient of electrical circuit parts is sometimes specified as ppm/°C, or ppm/K. This specifies the fraction (expressed in parts per million) that its electrical characteristics will deviate when taken to a temperature above or below the operating temperature.
Very high thermal conductivity measurements up to 22,600 w m −1 K −1 were reported by Fenton, E.W., Rogers, J.S. and Woods, S.D. in reference 570 on page 1458, 41, 2026–33, 1963. The data is listed on pages 6 through 8 and graphed on page 1 where Fenton and company are on curves 63 and 64.
The thermal conductivity of the interstitial material and its pressure, examined through reference to the Knudsen number, are the two properties governing its influence on contact conductance, and thermal transport in heterogeneous materials in general.