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A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
When a PCB has no components installed, it is less ambiguously called a printed wiring board (PWB) or etched wiring board. [18] However, the term "printed wiring board" has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). In informal ...
The ANOVA results showed that the strain concentration factor was the most important variable, followed with the ductility factor, metallization thickness, and via wall angle. Prabhu et al. [ 10 ] conducted a finite element analysis (FEA) on an HDI microvia structure to determine the effect of accelerated temperature cycling and thermal shock.
Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.
A small, highly integrated form factor, designed for small devices such as thin clients and set-top boxes. Nano-ITX: VIA 2003 120 × 120 mm (4.7 × 4.7 in) Targeted at smart digital entertainment devices such as PVRs, set-top boxes, media centers and Car PCs, and thin devices. Pico-ITX: VIA 2007 100 × 72 mm max (3.9 × 2.8 in) Mobile-ITX: VIA
A coupon or test coupon is a printed circuit board (PCB) used to test the quality of a printed wiring board (PWB) fabrication process. Test coupons are fabricated on the same panel as the PWBs, typically at the edges. Coupons are then inspected to ensure proper layer alignment, electrical connectivity, and cross sectioned to inspect internal ...
Dry film conformal coating thickness measurement. An alternative to wet film measurement is by using eddy currents. The system works by placing the test head on the surface of the conformal coating. When liquid water is present, a pinhole can form in the coating. This is considered a defect and can be eliminated with appropriate steps and training.
The size and shape of the metal particles in the solder paste determines how well the paste will "print". A solder ball is spherical in shape; this helps in reducing surface oxidation and ensures good joint formation with the adjoining particles. Irregular particle sizes are not used, as they tend to clog the stencil, causing printing defects.
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