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Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...
Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask ), creating a mechanical and electrical connection.
Wave soldering uses surface tension to keep solder from bridging the insulating gaps between the copper lines of flux-coated printed wiring boards/printed circuit boards. The electric soldering iron is widely used for hand-soldering, consisting of a heating element in contact with the "iron" (a larger mass of metal, usually copper) which is in ...
Wave soldering is a bulk soldering process used in printed circuit board manufacturing. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used ...
Sensors installed to a fixture to check selective solder machine parameters Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes.
Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...
When potting a circuit board that uses surface-mount technology, low glass transition temperature (T g) potting compounds such as polyurethane or silicone may be used. High T g potting compounds may break solder bonds through solder fatigue by hardening at a higher temperature because the coating then shrinks as a rigid solid over a larger part ...
When lead-free solder is used in wave soldering, a slightly modified solder pot may be desirable (e.g. titanium liners or impellers) to reduce maintenance cost due to increased tin-scavenging of high-tin solder. Lead-free solder is prohibited in critical applications, such as aerospace, military and medical projects, because joints are likely ...