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Applicability to wide range of materials (metals, ceramics, polymers, ) Easy control of the coating composition. The process is normally automated and requires less human labor than other coating processes. Highly efficient utilization of the coating materials result in lower costs relative to other processes.
The net result is the effective transfer of metal from the anode to the cathode. [4] The anode may instead be made of a material that resists electrochemical oxidation, such as lead or carbon. Oxygen, hydrogen peroxide, and some other byproducts are then produced at the anode instead. In this case, ions of the metal to be plated must be ...
When the nozzle approaches the substrate, the meniscus is formed at the nozzle tip, and functions as a confined electrodeposition bath. A two-electrode configuration was employed for the L-PED process, consists of a working electrode (the substrate) and a counter electrode (a metal wire which is inserted within the micropipette).
LIGA consists of three main processing steps: lithography, electroplating, and molding. There are two main LIGA-fabrication technologies: X-Ray LIGA, which uses X-rays produced by a synchrotron to create high-aspect-ratio structures, and UV LIGA, a more accessible method which uses ultraviolet light to create structures with relatively low aspect ratios.
Copper plating on aluminium. Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [1]
Electroforming is a metal forming process in which parts are fabricated through electrodeposition on a model, known in the industry as a mandrel. Conductive (metallic) mandrels are treated to create a mechanical parting layer, or are chemically passivated to limit electroform adhesion to the mandrel and thereby allow its subsequent separation.
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
Using EC-AFM allows to fabricate metal and semiconductor nanostructures on the WE, gaining high thermal stability and a higher chemical diversity. Finally, it is possible to perform and study the electrodeposition of different materials on electrodes, from metals (i.e. copper [13]) to polymers, such as polyaniline (PANI). [14] [15]