Search results
Results from the WOW.Com Content Network
While the task of testing a single logic gate at a time sounds simple, there is an obstacle to overcome. For today's highly complex designs, most gates are deeply embedded whereas the test equipment is only connected to the primary Input/outputs (I/Os) and/or some physical test points. The embedded gates, hence, must be manipulated through ...
ATPG (acronym for both automatic test pattern generation and automatic test pattern generator) is an electronic design automation method or technology used to find an input (or test) sequence that, when applied to a digital circuit, enables automatic test equipment to distinguish between the correct circuit behavior and the faulty circuit behavior caused by defects.
Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.
Keithley Instruments Series 4200 CVU. Automatic test equipment or automated test equipment (ATE) is any apparatus that performs tests on a device, known as the device under test (DUT), equipment under test (EUT) or unit under test (UUT), using automation to quickly perform measurements and evaluate the test results.
Digital design focuses on logical correctness, maximizing circuit density, and placing circuits so that clock and timing signals are routed efficiently. Analog IC design also has specializations in power IC design and RF IC design. Analog IC design is used in the design of op-amps, linear regulators, phase locked loops, oscillators and active ...
the probe will act as a circuit and affect the results of the test. For this reason, the tests performed at wafer sort cannot always be identical and as extensive as those performed at the final device test after packaging is complete [3] since the probe pads are typically on the perimeter of the IC, the IC can soon become pad-limited.
Depending on the product, the machines that we are referring to could mean a combination of Automatic Test Equipment (ATE), handler, interface board, and test program that drives the ATE, as with the case of the IC chip testing. Test automation is a big part of a test engineer's job. The whole intention of automating the test is as follows:
In semiconductor testing, the device under test is a die on a wafer or the resulting packaged part. A connection system is used, connecting the part to automatic or manual test equipment. The test equipment then applies power to the part, supplies stimulus signals, then measures and evaluates the resulting outputs from the device.