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  2. Socket 370 - Wikipedia

    en.wikipedia.org/wiki/Socket_370

    The weight of a Socket 370 CPU cooler should not exceed 180 grams (6.3 ounces). Heavier coolers may result in damage to the die when the system is improperly handled. Most Intel Socket 370 processors (Pentium III and Celeron) had mechanical maximum load limits which were designed not be exceeded during heat sink assembly, shipping conditions ...

  3. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    A heat sink (aluminum) with its heat pipes (copper) and fan (black) A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of ...

  4. Socket AM2 - Wikipedia

    en.wikipedia.org/wiki/Socket_AM2

    The Socket AM2, renamed from Socket M2 (to prevent using the same name as Cyrix MII processors), is a CPU socket designed by AMD for desktop processors, including the performance, mainstream and value segments. It was released on May 23, 2006, as a replacement for Socket 939.

  5. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...

  6. Computer fan - Wikipedia

    en.wikipedia.org/wiki/Computer_fan

    A small blower fan is used to direct air across a laptop computer's CPU cooler. A case fan may be mounted on a radiator attached to the case, simultaneously operating to cool a liquid cooling device's working fluid and to ventilate the case. In laptops, a single blower fan often cools a heat sink connected to both CPU and GPU using heat pipes.

  7. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power ( TDP ), also known as thermal design point , is the maximum amount of heat that a computer component (like a CPU , GPU or system on a chip ) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo ...

  8. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    CPU heat sink with fan attached A heat sink (aluminium) incorporating a heat pipe (copper) All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. [1]

  9. Centrifugal fan - Wikipedia

    en.wikipedia.org/wiki/Centrifugal_fan

    A centrifugal fan is a mechanical device for moving air or other gases in a direction at an angle to the incoming fluid. Centrifugal fans often contain a ducted housing to direct outgoing air in a specific direction or across a heat sink; such a fan is also called a blower, blower fan, or squirrel-cage fan (because it looks like a hamster wheel).