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USB 3.0 is the third major version of the Universal Serial Bus (USB) standard for interfacing computers and electronic devices. Among other improvements, USB 3.0 adds the new transfer rate referred to as SuperSpeed USB (SS) that can transfer data at up to 5 Gbit/s (625 MB/s), which is about 10 times faster than the USB 2.0 standard.
For example, a USB 2 PCIe host controller card that presents 4 USB "Standard A" connectors typically presents one 4-port EHCI and two 2-port OHCI controllers to system software. When a high-speed USB device is attached to any of the 4 connectors, the device is managed through one of the 4 root hub ports of the EHCI controller.
The USB 3.0 specification defined a new architecture and protocol named SuperSpeed (aka SuperSpeed USB, marketed as SS), which included a new lane for a new signal coding scheme (8b/10b symbols, 5 Gbit/s; later also known as Gen 1) providing full-duplex data transfers that physically required five additional wires and pins, while preserving the ...
The USB mass storage device class (also known as USB MSC or UMS) is a set of computing communications protocols, specifically a USB Device Class, defined by the USB Implementers Forum that makes a USB device accessible to a host computing device and enables file transfers between the host and the USB device. To a host, the USB device acts as an ...
Open Host Controller Interface (OHCI) [1] is an open standard.. Die shot of a VIA VT6307 Integrated Host Controller used for IEEE 1394A communication. When applied to an IEEE 1394 (also known as FireWire; i.LINK or Lynx) card, OHCI means that the card supports a standard interface to the PC and can be used by the OHCI IEEE 1394 drivers that come with all modern operating systems.
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A USB compound device contains an embedded USB hub and one or more non-removable USB devices. [1] It may or may not have exposed downstream ports. The internal USB hub may be a physical IC that connects to other ICs, or the hub and all functions may be implemented in software on a single IC (though it is more common to integrate them as a composite device in this case).
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