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Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common.
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding or solid-state welding. Two metals, e.g. gold - gold (Au) , are brought into atomic contact applying force and heat simultaneously. [ 1 ]
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It is an allotrope of carbon in the form of a plane of sp 2-bonded atoms with a molecular bond length of 0.142 nm (1.42 Å). In a graphene sheet, each atom is connected to its three nearest carbon neighbors by σ-bonds , and a delocalized π-bond , which contributes to a valence band that extends over the whole sheet.
The name "tight binding" of this electronic band structure model suggests that this quantum mechanical model describes the properties of tightly bound electrons in solids. . The electrons in this model should be tightly bound to the atom to which they belong and they should have limited interaction with states and potentials on surrounding atoms of the sol
A rapidly increasing list of graphene production techniques have been developed to enable graphene's use in commercial applications. [1]Isolated 2D crystals cannot be grown via chemical synthesis beyond small sizes even in principle, because the rapid growth of phonon density with increasing lateral size forces 2D crystallites to bend into the third dimension. [2]