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Electrophoretic coating began to take its current shape in the late 1950s, when Dr. George E. F. Brewer and the Ford Motor Company team began working on developing the process for the coating of automobiles. The first commercial anodic automotive system began operations in 1963.
The history of electrophoresis for molecular separation and chemical analysis began with the work of Arne Tiselius in 1931, while new separation processes and chemical speciation analysis techniques based on electrophoresis continue to be developed in the 21st century. [13]
The bilayers and wash steps can be performed in many different ways including dip coating, spin-coating, spray-coating, flow based techniques and electro-magnetic techniques. [1] The preparation method distinctly impacts the properties of the resultant films, allowing various applications to be realized. [ 1 ]
Postulated migration of proteins in a Laemmli gel system A: Stacking gel, B: Resolving gel, o: sample application c: discontinuities in the buffer and electrophoretic matrix. Most protein separations are performed using a "discontinuous" (or DISC) buffer system that significantly enhances the sharpness of the bands within the gel. During ...
There are two common methods in which to construct a DNA molecular-weight size marker. [3] One such method employs the technique of partial ligation. [3] DNA ligation is the process by which linear DNA pieces are connected to each other via covalent bonds; more specifically, these bonds are phosphodiester bonds. [4]
PVD coatings have the ability to utilize virtually any type of inorganic and some organic coating materials on an equally diverse group of substrates and surfaces using a wide variety of finishes. PVD processes are often more environmentally friendly than traditional coating processes such as electroplating and painting.
One such example is the formation of silver chloride on silver wire in chloride solutions to make silver/silver-chloride (AgCl) electrodes. Electropolishing, a process that uses an electric current to selectively remove the outermost layer from the surface of a metal object, is the reverse of the process of electroplating. [1]
Thin-film deposition is a process applied in the semiconductor industry to grow electronic materials, in the aerospace industry to form thermal and chemical barrier coatings to protect surfaces against corrosive environments, in optics to impart the desired reflective and transmissive properties to a substrate and elsewhere in industry to modify surfaces to have a variety of desired properties.