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A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, [1] and may or may not cover the entire underside of the package.
A sensor array is a group of sensors, usually deployed in a certain geometry pattern, used for collecting and processing electromagnetic or acoustic signals. The advantage of using a sensor array over using a single sensor lies in the fact that an array adds new dimensions to the observation, helping to estimate more parameters and improve the estimation performance.
A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.
Not to be confused with Printed electronics. "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and ...
Employment grew to 25 employees. By 1975, PCB® had become one of the largest U.S. manufacturers of piezoelectric sensors. [citation needed] During the 1980s, PCB® continued to develop new products. In 1982, the Structural* Modal Array Sensing System was developed to ease sensor installation and reduce set-up time on larger-scale modal surveys.
Thick-film circuits/modules are widely used in the automotive industry, both in sensors, e.g. mixture of fuel/air, pressure sensors, engine and gearbox controls, sensor for releasing airbags, ignitors to airbags; common is that high reliability is required, often extended temperature range also along massive thermocycling of circuits without ...
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