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  2. Housewrap - Wikipedia

    en.wikipedia.org/wiki/Housewrap

    Housewrap (or house wrap), also known by the genericized trademark homewrap (or home wrap), generally denotes a modern synthetic material used to protect buildings. Housewrap functions as a weather-resistant barrier , preventing rain or other forms of moisture from getting into the wall assembly while allowing water vapor to pass to the exterior.

  3. Plastic wrap - Wikipedia

    en.wikipedia.org/wiki/Plastic_wrap

    Plastic wrap, cling film, Saran wrap, cling wrap, Glad wrap or food wrap is a thin plastic film typically used for sealing food items in containers to keep them fresh over a longer period of time. Plastic wrap, typically sold on rolls in boxes with a cutting edge, clings to many smooth surfaces and can thus remain tight over the opening of a ...

  4. Vehicle vinyl wrap - Wikipedia

    en.wikipedia.org/wiki/Vehicle_vinyl_wrap

    Color change and paint wrap is a term used by wrap installers and refers to a full-color change, as if one were 'painting' a car with a vinyl wrap. Demand for color matching vinyl wrap has grown. The wrap is manufactured to match vehicle paint colors and metallics, as well as in colors used in print such as Pantone colors. Most color change ...

  5. Ring enhancer - Wikipedia

    en.wikipedia.org/wiki/Ring_enhancer

    Ring enhancers, also called ring guards, ring wraps, or curved rings are uniquely designed rings, created to be worn with solitaire diamond rings.The sole purpose of a ring enhancer is to complement a diamond solitaire ring with additional diamonds or gemstones, in order to enhance the size and appearance of a solitaire engagement ring.

  6. Amy Deasismont - Wikipedia

    en.wikipedia.org/wiki/Amy_Deasismont

    Amy Linnéa Deasismont (born 15 April 1992), previously known under the stage name Amy Diamond, is a Swedish actress, screenwriter, [1] director, and singer. She is known for her single " What's in It for Me ".

  7. Die singulation - Wikipedia

    en.wikipedia.org/wiki/Die_singulation

    Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.

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