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The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.
7805 in TO-220 and TO-92 packages Internal die of a Tesla MA7805 78xx (sometimes L78xx , LM78xx , MC78xx ...) is a family of self-contained fixed linear voltage regulator integrated circuits . The 78xx family is commonly used in electronic circuits requiring a regulated power supply due to their ease-of-use and low cost.
LM317 with heat sink. The LM317 is an adjustable positive linear voltage regulator. It was designed by Bob Dobkin in 1976 while he worked at National Semiconductor. [1] The LM337 is the negative complement to the LM317, which regulates voltages below a reference. It was designed by Bob Pease, who also worked for National Semiconductor. [1]
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature.
The TO-3 package consists of a diamond-shaped base plate with diagonals of 40.13 mm (1.580 in) and 27.17 mm (1.070 in). The plate has two mounting holes on the long diagonal, with the centers spaced 30.15 mm (1.187 in) apart. [5] The cap attached to one side of the plate brings the total height to up to 11.43 mm (0.450 in).
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Vishay Semiconductor have released 20W resistors in TO-220 form. so this indicates the expected heat dissipation of the package with a heatsink. source: "TPR Thick Film Technology 20 Watt Power Resistors TO-220 Package". there are 50W zeners in TO-3, and 10W in DO-4, 100W in DO-5 (for comparison). Charlieb000 21:22, 3 August 2012 (UTC)