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Plasma cutting is a process that cuts through electrically conductive materials by means of an accelerated jet of hot plasma. Typical materials cut with a plasma torch include steel, stainless steel, aluminum, brass and copper, although other conductive metals may be cut as well. Plasma cutting is often used in fabrication shops, automotive ...
Fig. 2. The construction of Inductively Coupled Plasma torch. [3] A: cooling gas tangential flow to the outer quartz tube B: discharge gas flow (usually Ar) C: flow of carrier gas with sample D: induction coil which forms the strong magnetic field inside the torch E: force vectors of the magnetic field F: the plasma torch (the discharge).
Plasma gasification is an extreme thermal process using plasma which converts organic matter into a syngas (synthesis gas) which is primarily made up of hydrogen and carbon monoxide. A plasma torch powered by an electric arc is used to ionize gas and catalyze organic matter into syngas , with slag [ 1 ] [ 2 ] [ 3 ] remaining as a byproduct.
Plasma torch. A plasma torch cutter. A plasma torch (also known as a plasma arc, plasma gun, plasma cutter, or plasmatron) is a device for generating a directed flow of plasma. [1][2][3] The plasma jet can be used for applications including plasma cutting, plasma arc welding, plasma spraying, and plasma gasification for waste disposal. [4]
PECVD machine at LAAS technological facility in Toulouse, France. Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases.
Plasma cleaning is the removal of impurities and contaminants from surfaces through the use of an energetic plasma or dielectric barrier discharge (DBD) plasma created from gaseous species. Gases such as argon and oxygen, as well as mixtures such as air and hydrogen/nitrogen are used.
A plasma etcher, or etching tool, is a tool used in the production of semiconductor devices. A plasma etcher produces a plasma from a process gas, typically oxygen or a fluorine -bearing gas, using a high frequency electric field, typically 13.56 MHz. A silicon wafer is placed in the plasma etcher, and the air is evacuated from the process ...
The plasma approximation: The plasma approximation applies when the plasma parameter Λ, [26] representing the number of charge carriers within the Debye sphere is much higher than unity. [ 19 ] [ 20 ] It can be readily shown that this criterion is equivalent to smallness of the ratio of the plasma electrostatic and thermal energy densities.
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