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The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.
View history; Tools. Tools. move to sidebar hide. Actions Read; Edit; View history; General ... i7-14700K i7-13700KF i7-14700KF i7-13700F i7-14790F i7-13700 i7-14700
With their prospering business for eleven years, in 1996, the company moved its corporate office at San Francisco Del Monte, Quezon City, Philippines and started to expand branches, nationwide. In 1997, First International Computer (FIC), a Taiwanese-based manufacturer of computer motherboards, [ 2 ] appointed Silicon Valley as their ...
Intel Celeron G3930 die shot Intel Celeron G3930 top view Intel Celeron G3930 bottom view. Features common to desktop Kaby Lake CPUs: LGA 1151 socket; DMI 3.0 and PCIe 3.0 interfaces; Dual channel memory support in the following configurations: DDR3L-1600 1.35 V (32 GB maximum) or DDR4-2400 1.2 V (64 GB maximum) A total of 16 PCIe lanes
DDR4-2933 memory support for Core i7 and i9; DDR4-2666 for Core i3, Core i5, Pentium Gold, Celeron; 400-series chipset based on the LGA 1200 socket; Comet Lake-H compared to Coffee Lake-H Refresh. Higher turbo frequencies by up to 300 MHz; DDR4-2933 memory support; Thermal Velocity Boost for Core i7 and i9; Comet Lake-U compared to Whiskey Lake-U
Core i7 parts contain 8/8 cores/threads compared to 6/12 in 8th generation Core i7 parts. Core i3 parts are equipped with Turbo Boost technology. Even though the CPUs with F suffix lack an integrated GPU, Intel set the same price for these CPUs as their featureful counterparts. [ 27 ]
Rocket Lake is Intel's codename for its 11th generation Core microprocessors.Released on March 30, 2021, [2] it is based on the new Cypress Cove microarchitecture, a variant of Sunny Cove (used by Intel's Ice Lake mobile processors) backported to Intel's 14 nm process node. [4]
Lunar Lake is the first processor design by Intel where all logic dies are entirely fabricated on external nodes outsourced to TSMC.An analysis by Goldman Sachs indicated that Intel would be spending $5.6 billion in 2024 and $9.7 billion in 2025 outsourcing to TSMC. [5]