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Printed circuit board manufacturing is the process of manufacturing bare printed circuit boards (PCBs) and populating them with electronic components. It includes all the processes to produce the full assembly of a board into a functional circuit board. In board manufacturing, multiple PCBs are grouped on a single panel for efficient processing.
When a PCB has no components installed, it is less ambiguously called a printed wiring board (PWB) or etched wiring board. [18] However, the term "printed wiring board" has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). In informal ...
Many of the techniques of digital image processing, or digital picture processing as it often was called, were developed in the 1960s, at Bell Laboratories, the Jet Propulsion Laboratory, Massachusetts Institute of Technology, University of Maryland, and a few other research facilities, with application to satellite imagery, wire-photo standards conversion, medical imaging, videophone ...
A flash creates a single simple graphic in a location by shining light through an aperture of the appropriate shape at a fixed location. [8]: 234 Modern photoplotters are generally raster-scan devices that use a laser beam focused to one or more spots, modulated at multi-megahertz rates to form the image. [6]: 283-
DIMMs are often referred to as "single-sided" or "double-sided" to describe whether the DRAM chips are located on one or both sides of the module's printed circuit board (PCB). However, these terms may cause confusion, as the physical layout of the chips does not necessarily relate to how they are logically organized or accessed.
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the ...
The highly serialized nature of wafer processing has increased the demand for metrology in between the various processing steps. For example, thin film metrology based on ellipsometry or reflectometry is used to tightly control the thickness of gate oxide, as well as the thickness, refractive index, and extinction coefficient of photoresist and ...
A milled printed circuit board. Printed circuit board milling (also: isolation milling) is the milling process used for removing areas of copper from a sheet of printed circuit board (PCB) material to recreate the pads, signal traces and structures according to patterns from a digital circuit board plan known as a layout file. [1]
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