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Some single-sided boards which have plated-through holes are made in this way. General Electric made consumer radio sets in the late 1960s using additive boards. The (semi-)additive process is commonly used for multi-layer boards as it facilitates the plating-through of the holes to produce conductive vias in the circuit board.
This is also true for low-power applications (from some milliwatts to some watts), as the PCB can be thermally enhanced by using thermal vias or wide tracks to improve convection. An advantage of this method is that multilayer PCB allows design of complex circuits, whereas DBC and IMS are mostly single-sided technologies. [8]
Many single sided circuits are built on a double sided substrate because of the crossover connections. An example of this use is the circuit that connects a mousepad to the motherboard. All connections on that circuit are located on only one side of the substrate, except a small crossover connection that uses the other side.
Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip ...
PCB manufacturing typically starts with a so-called core, a basic double-sided PCB. Layers beyond the first two are stacked from this basic building block. If two more layers are consecutively stacked from bottom of core, you can have a 1-2 via, a 1-3 via and a through hole .
With the advent of smartphones and hand-held electronic devices, microvias have evolved from single-level to stacked microvias that cross over multiple HDI layers. Sequential build-up (SBU) technology is used to fabricate HDI boards. The HDI layers are usually built up from a traditionally manufactured double-sided core board or multilayer PCB.
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