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Download as PDF; Printable version; ... The Ryzen family is an x86-64 microprocessor family from AMD, ... Ryzen 5000 series. Vermeer (5000 series, Zen 3 based) ...
Renoir Ryzen 4000 APU series with RX Vega (desktop & laptop) Lucienne Ryzen 5000 APU series (laptop) Mendocino Ryzen 7020 APU series (laptop) and Athlon 7020 APU series (laptop) Rome Epyc 7002 series (server) Zen 3 series CPUs and APUs (released 2020) Vermeer Ryzen 5000 series (desktop) Chagall Ryzen Threadripper 5000 series (desktop) Cezanne ...
Common features of Ryzen 5000 notebook APUs: Socket: FP6. All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 16 PCIe 3.0 lanes. Includes integrated GCN 5th generation GPU. Fabrication process: TSMC 7FF.
Common features of Ryzen 5000 desktop CPUs: Socket: AM4. All the CPUs support DDR4-3200 in dual-channel mode. All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. L1 cache: 64 KB per core (32 KB data + 32 KB instruction). L2 cache: 512 KB per core. Fabrication process: TSMC 7FF.
Ryzen 3 PRO 2100GE [2] found in some OEM markets in limited quantities. Ryzen (/ ˈ r aɪ z ən / RY-zən) [3] is a brand [4] of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture.
Advanced Micro Devices' (AMD) noted that laptops based on its Ryzen 5000 Series mobile processors will be available from first quarter of 2021 from leading manufacturers.
AMD has unveiled its first Ryzen 5000-series chips with built-in graphics, and it's promising a leap in performance over Intel equivalents. AMD unveils its first Ryzen 5000 CPUs with built-in graphics
Common features of Ryzen 5000 (Cezanne) desktop CPUs: Socket: AM4. CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF.