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Smart cut is a technological process that enables the transfer of very fine layers of crystalline silicon material onto a mechanical support. It was invented by Michel Bruel of CEA-Leti, and was protected by US patent 5374564. [1] The application of this technological procedure is mainly in the production of silicon-on-insulator (SOI) wafer ...
In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon
In 2013, Shortz lent his name and talents in puzzle writing and editing to a new bimonthly publication entitled Will Shortz' WordPlay, published by Penny Press. [17] He has said that his favorite crossword of all time is the Election Day crossword of November 5, 1996, designed by Jeremiah Farrell.
Taking this one stage further, the clue word can hint at the word or words to be abbreviated rather than giving the word itself. For example: "About" for C or CA (for "circa"), or RE. "Say" for EG, used to mean "for example". More obscure clue words of this variety include: "Model" for T, referring to the Model T.
A full specification sheet listing the paper's requirements for crossword puzzle submission can be found online or by writing to the paper. The Monday–Thursday, and usually Sunday, puzzles have a theme. This is often some sort of connection between at least three long across answers, such as similar types of puns, added letters, or hidden ...
Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw ) [ 2 ] or laser cutting .
Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film upon which the wafer is mounted ...