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  2. This is a list of terms used in the manufacture of electronic micro-components. Many of the terms are already defined and explained in Wikipedia; this glossary is for looking up, comparing, and reviewing the terms. You can help enhance this page by adding new terms or clarifying definitions of existing ones.

  3. Glossary of electrical and electronics engineering - Wikipedia

    en.wikipedia.org/wiki/Glossary_of_electrical_and...

    A semiconductor device that produces coherent laser radiation when properly energized. leakage inductance The inductance of a transformer that results from magnetic flux not linked by both primary and secondary windings. light-emitting diode A semiconductor device that produces light or infrared or ultraviolet radiation when properly energized.

  4. JEDEC - Wikipedia

    en.wikipedia.org/wiki/JEDEC

    JEDEC also has a dictionary of semiconductor terms. All of JEDEC standards are free on the Web for downloading after a free registration. JEDEC has issued widely used standards for device interfaces, such as the JEDEC memory standards for computer memory ( RAM ), including the DDR SDRAM standards.

  5. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Chip-size package (CSP) developed by National Semiconductor [21] COB: Chip on board: Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a ...

  6. Category:Semiconductors - Wikipedia

    en.wikipedia.org/wiki/Category:Semiconductors

    Main page; Contents; Current events; Random article; About Wikipedia; Contact us

  7. Integrated circuit design - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_design

    To add to the design challenge, device properties often vary between each processed semiconductor wafer. Device properties can even vary significantly across each individual IC due to doping gradients. The underlying cause of this variability is that many semiconductor devices are highly sensitive to uncontrollable random variances in the process.

  8. US plans $75 million grant to Absolics for advanced chip ...

    www.aol.com/news/us-plans-75-million-grant...

    The US Commerce Department said on Thursday it plans to grant $75 million to Absolics for constructing a 120,000-square-foot facility in Georgia that will supply advanced materials to the country ...

  9. List of computing and IT abbreviations - Wikipedia

    en.wikipedia.org/wiki/List_of_computing_and_IT...

    EAI—Enterprise Application Integration; EAP—Extensible Authentication Protocol; EAS—Exchange ActiveSync; EBCDIC—Extended Binary Coded Decimal Interchange Code; EBML—Extensible Binary Meta Language