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  2. TO-220 - Wikipedia

    en.wikipedia.org/wiki/TO-220

    The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.

  3. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  4. LM317 - Wikipedia

    en.wikipedia.org/wiki/LM317

    LM317 with heat sink. The LM317 is an adjustable positive linear voltage regulator. It was designed by Bob Dobkin in 1976 while he worked at National Semiconductor. [1] The LM337 is the negative complement to the LM317, which regulates voltages below a reference. It was designed by Bob Pease, who also worked for National Semiconductor. [1]

  5. 78xx - Wikipedia

    en.wikipedia.org/wiki/78xx

    7805 in TO-220 and TO-92 packages Internal die of a Tesla MA7805. 78xx (sometimes L78xx, LM78xx, MC78xx...) is a family of self-contained fixed linear voltage regulator integrated circuits. The 78xx family is commonly used in electronic circuits requiring a regulated power supply due to their ease-of-use and low cost.

  6. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  7. TO-3 - Wikipedia

    en.wikipedia.org/wiki/TO-3

    The case is used with high-power and high-current devices, on the order of a few tens of amperes current and up to a hundred watts of heat dissipation. The case surfaces are metal for good heat conductivity and durability. The metal-to-metal and metal-to-glass joints provide hermetic seals that protect the semiconductor from liquids and gases.

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    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

  9. Forward converter - Wikipedia

    en.wikipedia.org/wiki/Forward_converter

    A schematic showing the most important components of a forward converter. ATX PC Power Supply with Forward Converter (heat sinks are removed for better view) The forward converter is a DC/DC converter that uses a transformer to increase or decrease the output voltage (depending on the transformer ratio) and provide galvanic isolation for the ...

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