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A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
These walls commonly form part of the device enclosure. The large holes in the via fences seen in figures 1 and 5 are screw holes for clamping these walls in place. The wall casting belonging to this circuit is shown in figure 3. [5] Figure 4. Via hole equivalent circuit. The design of the fence needs to consider the size and spacing of the vias.
PCB-Investigator is a software tool used for the analysis, visualization, and optimization of printed circuit boards (PCBs). It is used for tasks such as PCB design validation and quality assurance. It is developed by EasyLogix [1] owned by Schindler & Schill GmbH, a German company specializing in electronic design automation (EDA) software.
When a PCB has no components installed, it is less ambiguously called a printed wiring board (PWB) or etched wiring board. [18] However, the term "printed wiring board" has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). In informal ...
The Proteus Design Suite is a Windows application for schematic capture, simulation, and PCB (Printed Circuit Board) layout design.It can be purchased in many configurations, depending on the size of designs being produced and the requirements for microcontroller simulation.
A substrate-integrated waveguide (SIW) (also known as post-wall waveguide or laminated waveguide) is a synthetic rectangular electromagnetic waveguide formed in a dielectric substrate by densely arraying metallized posts or via holes that connect the upper and lower metal plates of the substrate.
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.
For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008). Exceptions occur for imperial in the two smallest rectangular passive sizes. The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned.
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