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2. Power electronic substrate - Wikipedia

   en.wikipedia.org/wiki/Power_electronic_substrate

   The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components.. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation (up to several thousand vo

3. Potting (electronics) - Wikipedia

   en.wikipedia.org/wiki/Potting_(electronics)

   [4] As an alternative, many circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. [5] Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair. Conformal coatings can be applied as liquid or condensed from a vapor phase.

4. Flatpack (electronics) - Wikipedia

   en.wikipedia.org/wiki/Flatpack_(electronics)

   A flatpack integrated circuit on a circuit board, among TO-5 packages. The original flatpack was invented by Y. Tao in 1962 while he was working for Texas Instruments to improve heat dissipation. The dual in-line package was invented two years later. The first devices measured 1/4 inch by 1/8 inch (3.2 mm by 6.4 mm) and had 10 leads. [1]

5. Land grid array - Wikipedia

   en.wikipedia.org/wiki/Land_grid_array

   LGA 1700 socket on a motherboard.. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]

6. Flat no-leads package - Wikipedia

   en.wikipedia.org/wiki/Flat_no-leads_package

   Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology , one of several package technologies that connect ICs to the ...

7. Merix Corporation - Wikipedia

   en.wikipedia.org/wiki/Merix_Corporation

   Merix Corporation was an American printed circuit board (PCB) manufacturer based in Beaverton, Oregon. [2] Prior to a merger in 2010 with Viasystems, the company had been the 31st largest public company in Oregon based on market capitalization as of 2006. [3] [4] The company is now part of TTM Technologies.