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English: Circuit diagram of an SRAM cell, built with six MOSFETs. The bulk connection of all transistors is to ground, but is not shown from simplicity. The bulk connection of all transistors is to ground, but is not shown from simplicity.
Two additional access transistors serve to control the access to a storage cell during read and write operations. 6T SRAM is the most common kind of SRAM. [20] In addition to 6T SRAM, other kinds of SRAM use 4, 5, 7, [ 21 ] 8, 9, [ 20 ] 10 [ 22 ] (4T, 5T, 7T 8T, 9T, 10T SRAM), or more transistors per bit.
On August 18, 2008, AMD, Freescale, IBM, STMicroelectronics, Toshiba, and the College of Nanoscale Science and Engineering (CNSE) announced that they jointly developed and manufactured a 22 nm SRAM cell, built on a traditional six-transistor design on a 300 mm wafer, which had a memory cell size of just 0.1 μm 2. [7]
The use of semiconductor RAM dates back to 1965 when IBM introduced the monolithic (single-chip) 16-bit SP95 SRAM chip for their System/360 Model 95 computer, and Toshiba used bipolar DRAM memory cells for its 180-bit Toscal BC-1411 electronic calculator, both based on bipolar transistors.
SRAM became an alternative to magnetic-core memory, but required six MOS transistors for each bit of data. [21] Commercial use of SRAM began in 1965, when IBM introduced their SP95 SRAM chip for the System/360 Model 95. [9] Toshiba introduced bipolar DRAM memory cells for its Toscal BC-1411 electronic calculator in 1965.
DRAM chips during the early 1970s had three-transistor cells, before single-transistor cells became standard since the mid-1970s. [17] [15] CMOS memory was commercialized by RCA, which launched a 288-bit CMOS SRAM memory chip in 1968. [23] CMOS memory was initially slower than NMOS memory, which was more widely used by computers in the 1970s. [24]
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TSMC began risk production of 256 Mbit SRAM memory chips using a 7 nm process in April 2017. [125] Samsung and TSMC began mass production of 7 nm devices in 2018. [126] Apple A12 and Huawei Kirin 980 mobile processors, both released in 2018, use 7 nm chips manufactured by TSMC. [127]