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  2. Laser cutting - Wikipedia

    en.wikipedia.org/wiki/Laser_cutting

    Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists.

  3. AI broadcasts, laser player tracking: A look at the coolest ...

    www.aol.com/ai-broadcasts-laser-player-tracking...

    The MLS 360 Spanish team talks with Commissioner Don Garber, center, before the 2024 MLS All-Star Game at Lower.com. ... Player laser tracking. Lidar laser technology has been on the forefront for ...

  4. Laser cutting bridge - Wikipedia

    en.wikipedia.org/wiki/Laser_cutting_bridge

    In textile manufacturing, a laser cutting bridge system is an industrial machine for cutting and engraving textile materials (i.e. fabrics). It is formed by a galvanometric laser head and carbon-dioxide laser (CO 2 laser) source that runs along an horizontal beam (the bridge) supported by two lateral columns and sometimes by central columns.

  5. Multiaxis machining - Wikipedia

    en.wikipedia.org/wiki/Multiaxis_machining

    Multiaxis machining is a manufacturing process that involves tools that move in 4 or more directions and are used to manufacture parts out of metal or other materials by milling away excess material, by water jet cutting or by laser cutting. This type of machining was originally performed mechanically on large complex machines.

  6. Laser engraving - Wikipedia

    en.wikipedia.org/wiki/Laser_engraving

    Laser engraving metal plates are manufactured with a finely polished metal, coated with an enamel paint made to be "burned off". At levels of 10 to 30 watts, excellent engravings are made as the enamel is removed quite cleanly. Much laser engraving is sold as exposed brass or silver-coated steel lettering on a black or dark-enamelled background.

  7. Die singulation - Wikipedia

    en.wikipedia.org/wiki/Die_singulation

    Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.

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