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The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
Heat sinks function by efficiently transferring thermal energy ("heat") from an object at high temperature to a second object at a lower temperature with a much greater heat capacity. This rapid transfer of thermal energy quickly brings the first object into thermal equilibrium with the second, lowering the temperature of the first object ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Fans attached to components are usually used in combination with a heat sink to increase the area of heated surface in contact with the air, thereby improving the efficiency of cooling. Fan control is not always an automatic process. A computer's BIOS can control the speed of the built-in fan system for the computer. A user can even supplement ...
Immersion cooling technology encompasses systems in which electronic components are directly exposed to and interact with dielectric fluids for cooling purposes. This includes systems using single-phase or two-phase dielectric fluids, leveraging their thermal capabilities to manage and dissipate heat generated by electronic components.
In the study of heat transfer, fins are surfaces that extend from an object to increase the rate of heat transfer to or from the environment by increasing convection. The amount of conduction, convection, or radiation of an object determines the amount of heat it transfers.