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In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; [1] in the latter case, they may be referred to as microbumps (μbumps ...
Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...
A ColdHeat soldering iron. ColdHeat was an American company founded to develop and market products using the proprietary graphite-like compound Athalite.The composite material is claimed by the manufacturer to have the unusual ability to conduct large amounts of heat and return to room temperature in a short amount of time.
Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.
The basic equipment used during the process is a conveyor that moves the PCB through the different zones, a pan of solder used in the soldering process, a pump that produces the actual wave, the sprayer for the flux and the preheating pad. The solder is usually a mixture of metals.
A thermal expansion valve or thermostatic expansion valve (often abbreviated as TEV, TXV, or TX valve) is a component in vapor-compression refrigeration and air conditioning systems that controls the amount of refrigerant released into the evaporator and is intended to regulate the superheat of the refrigerant that flows out of the evaporator ...
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