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Laser cutting. Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics.
The laser cutter is a machine that uses a laser to cut materials such as chip board, matte board, felt, wood, and acrylic up to 3/8 inch (1 cm) thickness. The laser cutter is often bundled with a driver software which interprets vector drawings produced by any number of CAD software platforms.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
Nd:YAP laser (yttrium aluminium perovskite) 1.0646 μm [7] Flashlamp, laser diode. Surgery, tattoo removal, hair removal, research, pumping other lasers (combined with frequency doubling to produce a green 532 nm beam) Nd:Cr:YAG laser. 1.064 μm, (1.32 μm) solar radiation. Experimental production of nanopowders.
Nd:YAG laser. Nd:YAG (neodymium-doped yttrium aluminum garnet; Nd:Y3Al5O12) is a crystal that is used as a lasing medium for solid-state lasers. The dopant, neodymium in the +3 oxidation state, Nd (III), typically replaces a small fraction (1%) of the yttrium ions in the host crystal structure of the yttrium aluminum garnet (YAG), since the two ...
Laser metal deposition. (Redirected from Laser Metal Deposition) Laser metal deposition (LMD) is an additive manufacturing process in which a feedstock material (typically a powder) is melted with a laser and then deposited onto a substrate. [1] A variety of pure metals and alloys can be used as the feedstock, as well as composite materials ...
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