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Adherence is the adhesive strength between photoresist and substrate. If the resist comes off the substrate, some features will be missing or damaged. Etching resistance Anti-etching is the ability of a photoresist to resist the high temperature, different pH environment or the ion bombardment in the process of post-modification. Surface tension
Middle Rio Grande at San Acacia, New Mexico: Elephant Butte Dam and Reservoir: 1916 Bureau of Reclamation: 2,065,010 acre feet Middle Rio Grande, 3.75 miles east of Truth or Consequences: Caballo Dam and Reservoir: 1938 Bureau of Reclamation: 331,510 acre-feet Rio Grande, 17 miles downstream from Elephant Butte Dam Percha Diversion Dam: 1918 ...
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Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer ...
Polymers tend to be etched easily by oxygen, fluorine, chlorine and other reactive gases used in plasma etching. Use of a hardmask involves an additional deposition process, and hence additional cost. First, the hardmask material is deposited and etched into the required pattern using a standard photoresist process.
A variation on this approach which eliminates the first hardmask etch is resist freezing, [50] which allows a second resist coating over the first developed resist layer. JSR has demonstrated 32 nm lines and spaces using this method, [51] where the freezing is accomplished by surface hardening of the first resist layer.
Lift-off is applied in cases where a direct etching of structural material would have undesirable effects on the layer below. Lift-off is a cheap alternative to etching in a research context, which permits a slower turn-around time. Finally, lifting off a material is an option if there is no access to an etching tool with the appropriate gases.
Etching processes use a resist, though in these typically the whole object is covered in the resist (called the "ground" in some contexts), which is then selectively removed from some parts. This is the case when a resist is used to prepare the copper substrate for champlevé enamels , where parts of the field are etched (with acid or ...