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High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs [1] and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers ...
Solid-state drive (SSD) Hard disk drive (HDD) Price per capacity SSDs are generally more expensive than HDDs and are expected to remain so. As of early 2018, SSD prices were around $0.30 per gigabyte for 4 TB models. [23] HDDs, as of early 2018, were priced around $0.02 to $0.03 per gigabyte for 1 TB models. [23] Storage capacity
Fusion-io [4] United States No Formerly through Flash Forward, [5] a joint venture owned by Kioxia and Fusion-IO's parent, SanDisk Formerly No Formerly G.Skill [6] Taiwan No No Yes No No Gigabyte Technology: Taiwan No No Yes i-RAM No Greenliant Systems [7] United States No No Yes No Yes GS Nanotech [8] [9] Russia: No No Yes No No Hewlett ...
The DDR4 SDRAM is a high-speed dynamic random-access memory internally configured as 16 banks, 4 bank groups with 4 banks for each bank group for ×4/×8 and 8 banks, 2 bank groups with 4 banks for each bank group for ×16 DRAM. The DDR4 SDRAM uses an 8n prefetch architecture to achieve high-speed operation.
With data being transferred 64 bits at a time per memory module, DDR3 SDRAM gives a transfer rate of (memory clock rate) × 4 (for bus clock multiplier) × 2 (for data rate) × 64 (number of bits transferred) / 8 (number of bits in a byte). Thus with a memory clock frequency of 100 MHz, DDR3 SDRAM gives a maximum transfer rate of 6400 MB/s.
Samsung's implementation involves 16-gigabit (2 GB) dies, on a 14 nm process node, with modules with up to 32 dies (64 GB) in a single package. According to the company, the new modules would use 20% less power than LPDDR5. [ 31 ]
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