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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Although solder paste typically contains around 90% metal in solids by weight, the volume of the soldered joint is only about half that of the solder paste applied. [7] This is due to the presence of flux and other non-metallic agents in the paste, and the lower density of the metal particles when suspended in the paste as compared to the final ...

3. Flux (metallurgy) - Wikipedia

   en.wikipedia.org/wiki/Flux_(metallurgy)

   Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

4. Solder alloys - Wikipedia

   en.wikipedia.org/wiki/Solder_alloys

   For soldering n-type semiconductors, solder may be doped with antimony; indium may be added for soldering p-type semiconductors. Pure tin can also be used. [59] [96] Various fusible alloys can be used as solders with very low melting points; examples include Field's metal, Lipowitz's alloy, Wood's metal, and Rose's metal.

5. Tinning - Wikipedia

   en.wikipedia.org/wiki/Tinning

   The tinning set consists of at least one pot of molten tin, with a zinc chloride flux on top, and a grease pot. The flux dries the plate and prepares it for the tin to adhere. If a second tin pot is used, called the wash pot, it contains tin at a lower temperature. This is followed by the grease pot, which contains oil and a tinning machine ...

6. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process

7. Tin-silver-copper - Wikipedia

   en.wikipedia.org/wiki/Tin-silver-copper

   Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]