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A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
These walls commonly form part of the device enclosure. The large holes in the via fences seen in figures 1 and 5 are screw holes for clamping these walls in place. The wall casting belonging to this circuit is shown in figure 3. [5] Figure 4. Via hole equivalent circuit. The design of the fence needs to consider the size and spacing of the vias.
Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
High volume production is usually done with a pick-and-place machine and bulk wave soldering for through-hole parts or reflow ovens for SMT components or through-hole parts, but skilled technicians are able to hand-solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.) [29] under a microscope, using tweezers and a ...
Through-hole (leaded) resistors Through-hole devices mounted on the circuit board of a mid-1980s Commodore 64 home computer A box of drill bits used for making holes in printed circuit boards. While tungsten-carbide bits are very hard, they eventually wear out or break. Drilling is a considerable part of the cost of a through-hole printed ...
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For similar reasons, a technique called trace necking reduces (or necks down [7] [8] [9]) the width of a trace that approaches a narrower pad of a surface-mounted device or a through-hole with a diameter that is less than the width of the trace, or when the trace passes through bottlenecks (for example, between the pads of a component). [8] [9 ...
Ogunjimi et al. [9] looked at the effect of manufacturing and design process variables on the fatigue life of microvias, including trace (conductor) thickness, layer or layers of the dielectric around the trace and in the microvia, via geometry, via wall angle, ductility coefficient of the conductor material, and strain concentration factor ...
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