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Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...
Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process
Not to be confused with Printed electronics. "PC board" redirects here. For the mainboard of personal computers, see Motherboard. "Panelization" redirects here. For the page layout strategy, see N-up. Printed circuit board of a DVD player Part of a 1984 Sinclair ZX Spectrum computer board, a printed circuit board, showing the conductive traces, the through-hole paths to the other surface, and ...
Alternative to RCA for professional video electronics. Protocols: Serial digital interface (SDI) and HD-SDI. CoaXPress; 75 Ω for video signal (SDI and CoaXPress) on, for example, RG59 and RG6. 50 Ω for data link, like Ethernet on RG58. 93 Ω on RG62. 50 Ω (white/bottom row) and 75 Ω C connectors (red/top row) C connector (Concelman connector)
The processor is affixed to the motherboard by soldering the balls to the motherboard. This is thinner than a pin grid array socket arrangement, but is not removable. The 479 balls of the Micro-FCBGA package (a package almost identical to the 478-pin socketable micro-FCPGA package) are arranged as the 6 outer rings of a 1.27 mm pitch (20 balls ...
Soldering (US: / ˈ s ɒ d ər ɪ ŋ /; UK: / ˈ s oʊ l d ər ɪ ŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
A case's motherboard and power supply unit (PSU) form factor must all match, though some smaller form factor motherboards of the same family will fit larger cases. For example, an ATX case will usually accommodate a microATX motherboard. Laptop computers generally use highly integrated, miniaturized, and customized motherboards.