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Solderability when using lead-free alloys can differ significantly from solderability when using lead based alloys. Noble metals may be easy to solder but they have brittle joints. The metals in the good category require a large amount of heat therefore oxidation is an issue. To overcome this a flux is required.
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 62 Pb 37 Cu 1: 183 [17] Pb: Yes: Similar to Sn 63 Pb 37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 63 Pb 37 P 0.0015-0.04: 183 ...
Common solder alloys include tin-lead, tin-silver, and tin-copper, among others. Lead-free solder has also become more widely used in recent years due to health and environmental concerns associated with the use of lead. In addition to the type of solder used, the temperature and method of heating also play a crucial role in the soldering process.
The most common dip soldering operations use zinc-aluminum and tin-lead solders. Solder pot metal: cast iron or steel, electrically heated. Bath temperature: 220 to 260 °C (for binary tin-lead alloys) or 350 to 400 °C (for lead-free alloys) Solder composition: 60% Sn, 40% Pb or eutectic alloy.
A soldering station has a temperature control and consists of an electrical power supply, control circuitry with provision for user adjustment of temperature and display, and a soldering iron or soldering head with a tip temperature sensor. The station will normally have a stand for the hot iron when not in use, and a wet sponge for cleaning.
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