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  2. Desoldering - Wikipedia

    en.wikipedia.org/wiki/Desoldering

    Solder wick on a reel. Desoldering braid, also known as desoldering wick or solder wick, is finely braided 18 to 42 AWG copper wire coated with rosin flux, usually supplied on a roll. Solder wick, before use... and soaked with solder and residue. The end of a length of braid is placed over the soldered connections of a component being removed.

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).

  4. Rework (electronics) - Wikipedia

    en.wikipedia.org/wiki/Rework_(electronics)

    Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using a new one, and heating the ...

  5. Solder ball - Wikipedia

    en.wikipedia.org/wiki/Solder_ball

    The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] Ball grid array, chip-scale package, and flip chip packages generally use solder balls.

  6. Solder mask - Wikipedia

    en.wikipedia.org/wiki/Solder_mask

    A solder bridge is an unintended electrical connection between two conductors by means of a small blob of solder. PCBs use solder masks to prevent this from happening. Solder mask is not always used for hand soldered assemblies, but is essential for mass-produced boards that are soldered automatically using reflow or wave soldering techniques.

  7. Metal electrode leadless face - Wikipedia

    en.wikipedia.org/wiki/Metal_electrode_leadless_face

    During automated SMT pick-and-place, this happens mostly if the mechanical pressure of the SMD placer nozzle is too low. If the MELF components are placed into the solder paste with enough pressure, then this problem can be minimized. Care must be taken with glass diodes which are less mechanically robust than resistors and other MELF components.

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  9. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Soldering (US: / ˈ s ɒ d ər ɪ ŋ /; UK: / ˈ s oʊ l d ər ɪ ŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.

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