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PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation. PVD is used in the manufacturing of items which require thin films for optical, mechanical, electrical, acoustic or chemical ...
Meaning [1] Latin (or Neo-Latin) origin [1] a.c. before meals: ante cibum a.d., ad, AD right ear auris dextra a.m., am, AM morning: ante meridiem: nocte every night Omne Nocte a.s., as, AS left ear auris sinistra a.u., au, AU both ears together or each ear aures unitas or auris uterque b.d.s, bds, BDS 2 times a day bis die sumendum b.i.d., bid, BID
before meals a.c.h.s., ac&hs ante cibum et hora somni: before meals and at bedtime a.d. auris dextra: right ear a single-storey a can be mistaken as an o which could read "o.d.", meaning right eye ad., add. adde addatur: add let there be added ad lib. ad libitum: Latin, "at one's pleasure"; as much as one desires; freely
The PVD process can be carried out at lower deposition temperatures and without corrosive products, but deposition rates are typically lower. Electron-beam physical vapor deposition, however, yields a high deposition rate from 0.1 to 100 μm / min at relatively low substrate temperatures, with very high material utilization efficiency.
When the vapor source is a liquid or solid, the process is called physical vapor deposition (PVD), [3] which is used in semiconductor devices, thin-film solar panels, and glass coatings. [4] When the source is a chemical vapor precursor, the process is called chemical vapor deposition (CVD).
PVD: peripheral vascular disease: PVFS: post-viral fatigue syndrome: PVI: Peripheral vascular insufficiency Pulmonary vein isolation PVOD: Pulmonary venoocclusive disease: PVR: pulmonary vascular resistance Postvoid residual urine volume PVS: perivascular space persistent vegetative state pulmonary valve stenosis Plummer–Vinson syndrome: PVT
Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. [1] [2]
This is a list of terms used in the manufacture of electronic micro-components. Many of the terms are already defined and explained in Wikipedia; this glossary is for looking up, comparing, and reviewing the terms. You can help enhance this page by adding new terms or clarifying definitions of existing ones.