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Common features of Ryzen 5000 (Cezanne) desktop CPUs: Socket: AM4. CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF.
AMD Zen 3+ Family 19h – 2022 revision of Zen 3 used in Ryzen 6000 mobile processors using a 6 nm process. AMD Zen 4 Family 19h – fourth generation Zen architecture, in 5 nm process. [5] Used in Ryzen 7000 consumer processors on the new AM5 platform with DDR5 and PCIe 5.0 support. Adds support for AVX-512 instruction set.
Ryzen 3 PRO 2100GE [2] found in some OEM markets in limited quantities. Ryzen (/ ˈ r aɪ z ən /, RY-zən) [3] is a brand [4] of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture.
AMD K6: 1997 6 Superscalar, branch prediction, speculative execution, out-of-order execution, register renaming [b] AMD K6-III: 1999 Branch prediction, speculative execution, out-of-order execution [1] AMD K7: 1999 Out-of-order execution, branch prediction, Harvard architecture: AMD K8: 2003 64-bit, integrated memory controller, 16 byte ...
Core i7, on the desktop platform no longer supports hyper-threading; instead, now higher-performing core i9s will support hyper-threading on both mobile and desktop platforms. Before 2007 and post-Kaby Lake, some Intel Pentium and Intel Atom (e.g. N270, N450) processors support hyper-threading. Celeron processors never supported it.
Ryzen 5 7600 Ryzen 7 7700 Ryzen 9 7900 6/8/12 3700–3800 (5100–5400 boost) April 2023 Ryzen 7 7800X3D 8 4200 (5000 boost) 96 MB February 2023 Ryzen 9 7900X3D Ryzen 9 7950X3D 12/16 4200–4400 (5600–5700 boost) 96+32 MB March 2023 Phoenix Ryzen 7040 6/8 3800–4300 (5000–5200)
Zen-based CPUs and some APUs use the Ryzen brand, while some APUs use the Athlon brand. An AMD Ryzen 5 2600 Die shot of a Ryzen 3 1200 Zen series CPUs and APUs (released 2017)
Zen 3 was released on November 5, 2020, [30] using a more matured 7 nm manufacturing process, powering Ryzen 5000 series CPUs and APUs [30] (codename "Vermeer" (CPU) and "Cézanne" (APU)) and Epyc processors (codename "Milan"). Zen 3's main performance gain over Zen 2 is the introduction of a unified CCX, which means that each core chiplet is ...